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July 7/14, 2008 | ||||||||||||
Put a layer of copper nanorods on the bottom
of a pot and water boils with 10 times less energy than required using an
ordinary pot. The material works by feeding nanoscale bubbles into the microscopic
cavities that form the bubbles in boiling water, producing 30 times more
bubbles. The nanostructured material could be used to reduce the energy consumption of industrial processes that produce steam by boiling water. It could also be used to cool computer chips. Research paper: Nanostructured Copper Interfaces for Enhanced Boiling Small, published online June 23, 2008 Researchers' homepages: Chen Li Zuankai Wang Yoav Peles Nikhil Koratkar G. P. Peterson Related stories and briefs: none Back to TRN July 7/14, 2008 |
Research
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