Nano bubbles boost boiling

  July 7/14, 2008
Put a layer of copper nanorods on the bottom of a pot and water boils with 10 times less energy than required using an ordinary pot. The material works by feeding nanoscale bubbles into the microscopic cavities that form the bubbles in boiling water, producing 30 times more bubbles.

The nanostructured material could be used to reduce the energy consumption of industrial processes that produce steam by boiling water. It could also be used to cool computer chips.

Research paper:
Nanostructured Copper Interfaces for Enhanced Boiling
Small, published online June 23, 2008

Researchers' homepages:
Chen Li
Zuankai Wang
Yoav Peles
Nikhil Koratkar
G. P. Peterson

Related stories and briefs:

Back to TRN July 7/14, 2008

Research Watch blog
View from the High Ground Q&A
How It Works

RSS Feeds:
News  | Blog

Ad links: Clear History

Buy an ad link

Home     Archive     Resources    Feeds    Glossary
Search     Research Orgs    Events Dir.      Researchers     Bookshelf
   Contribute      T-shirts etc.     Ad Finder

© Copyright Technology Research News, LLC 2000-2008. All rights reserved.